2 Layer PCB Board FR4 2.0MM Gold Surface Finish General Purpose PWB  Board

TECHNOLOGY:

. RoHS/ Lead Free

. HDI Microvias

. Blind Vias

. Buried Vias

. Selective Plating

. Impedance Control

Manufacturing Standard:

. IPC-A-600G Class II

. IPC-A-600G Class III

. PERFAG 2E for Double-Sided Board

. PERFAG 3C for Multilayer Board

Capability

Min. Finished Holes Size: 0.008" (0.20mm)

Micro vias diameter: 0.004 TO 0.010 inches (0.10 - 0.25mm)

Minimum line width/spacing: 0.004/0.004 inches (0.10mm/ 0.10mm)

Maximum copper thickness: 5oz (140um)

Thin board thickness:

. DS - 0.008 inches (0.20mm)

. 4/L - 0.016 (0.40mm)

. 6/L - 0.020 inches (0.60mm)

Maximum board thickness:

. 275.8mil (7.0mm)

Surface treatment:

. HASL/lead free HAL/gold plating

. Immersion gold

. Immersion tin

. Immersion silver

. Gold fingers (hard gold)

. OSP

Other:

. Account of layers: Double-side to above 20 layers (1 to 30 layers)

. Max PCB dimensions: 23 X 35 inches (584.2 X 889.0mm)

. Solder mask bridge between solder dam: 4mil (0.10mm)

. Minimum solder mask annular: 1.5mil (0.038mm)

. Min thickness of solder mask: 0.40mil (10um)

. Solder mask colors: Green, yellow, black, blue, matte, transparence LPI solder mask and peelable solder mask

. Min height of Legend: 4mil (0.10mm)

. Min width of front: 25mil (0.635mm)

. Legend colors: White, yellow, black

Data format: GERBER, PROTEL, PADS2000, Powerpcb, ODB++

Special material: HTG FR4, high frequency (Rogers, Teflon, ARLON, TYCONIC), halogen free, different material mixing laminating

Other test: Impendence control, resistor of hole test, micro section, ionic cleanliness test, Soldering capacity, thermal shocking, reliability test, etc.